| Customization: | Available |
|---|---|
| Function for Resistance: | Protective Resistor, Load Resistor |
| Installation: | SMD Resistor |
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| ITEM | SPECIFICATION | TEST METHOD |
|---|---|---|
| Solderability | Over 95% of termination must be covered with solder | JIS C 5201 4.17 / MIL - STD - 202G METHOD 208H1 / IEC 61158 - 14 - 17 Reflow Soldering : Bath temperature (235 ± 5)°C, Immersion time (2 + 0.5)s WAVE Soldering : Bath temperature (270 ± 10)°C, Immersion time (2 + 0.5)s |
| Resistance to Solder Heat | J, G: ΔR ≤ ±(1 + 0.05%) F: ΔR ≤ ±(0.5 + 0.05%) No mechanical damage |
JIS C 5201 4.18 / MIL - STD - 202G METHOD 210F / IEC 61158 - 14 - 18 The temperature of the solder bath shall be (260 ± 5)°C, The immersion time shall be (5 + 1.0)s or (10 + 1.0)s as described by the specification |
| Temperature Coefficient of Resistance (TCR) | 0402 under - specification (0402 & 0201): 10 - 10³ > 3300ppm/°C 10³(including 10³) - 10 > 3300ppm/°C 0603 above - specification (0603 or above): 10 - 10² > 1100ppm/°C 10²(including 10²) - 10 > 1100ppm/°C |
JIS C 5201 4.8 / MIL - STD - 202G METHOD 304 / IEC 61158 - 14 - 8 The temperature characteristic or temperature coefficient of resistance is not specified for resistance values of less than 5R due to - difficulty of accurate measurement |
| Short Time Overload | J, G: R ≤ ±(1 + 0.05%) F: R ≤ ±(1 + 0.05%) 2.5×Rated Voltage or Max. Overload Voltage for 5 seconds. measure resistance after 30 minutes |
JIS C 5201 4.13 / IEC 61158 - 14 - 13 |
| Load Life Humidity | J, G: ΔR ≤ ±(3 + 0.05%) F: ΔR ≤ ±(3 + 0.05%) Maintain the temperature of the resistor at 40 ± 2°C and 90 - 95% RH with the rated voltage applied. Cycle ON for 1.5 hours and OFF for 0.5 hour for 1000 + 48 - 0 hours. After 1 - 4 hours, measure the resistance value. |
JIS C 5201 4.24 / MIL - STD - 202G METHOD 106G / IEC 61158 - 14 - 24 |
| Load Life | J, G: ΔR ≤ ±(3 + 0.05%) F: ΔR ≤ ±(3 + 0.05%) 70 ± 2°C. Max. working voltage for 1000 hrs with 1.5 hrs "ON" and 0.5 hrs "OFF" |
JIS C 5201 4.25 / MIL - STD - 202G METHOD 108A / IEC 61158 - 14 - 25 |
| Temperature Cycle | J, G: ΔR ≤ ±(1 + 0.05%) F: ΔR ≤ ±(0.5 + 0.05%) No mechanical damage Repeat 5 cycles as - 65°C (30 min.) + 25°C (2 - 3 min.) + 125°C (30 min.) + 25°C (2 - 3 min.) |
JIS C 5201 4.19 / MIL - STD - 202G METHOD 107G / IEC 61158 - 14 - 19 |
| Insulation | Between termination and coating must be over 1000MΩ | JIS C 5201 4.6 / MIL - STD - 202G METHOD 302 / IEC 61158 - 14 - 6 Test voltage: 100 ± 15V |
| Bending Strength | J, G: ΔR ≤ ±(1 + 0.05%) F: ΔR ≤ ±(0.5 + 0.05%) No mechanical damage Bend: 3mm for 0201, 0402, 0603, 0805, 1206 2mm for 1210, 1812, 1218, 1225, 2010, 2512 |
JIS C 5201 4.33 / MIL - STD - 202G METHOD 211A / IEC 61158 - 14 - 33 Resistance change after bent on the 90° PCB. |
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